| # | Tweet | Community | Topic | Views ▼ | Ratio | Engagement | Posted |
|---|---|---|---|---|---|---|---|
| 1 | [image] Thinner dies, more TSV area, thermal dissipation, and limited manufacturing capacity make HBM scaling much more difficult.
#HBM @hotchipsorg | Electronics Design Engineering | — | 581 | 0.1x | 16 | Aug 31 |
| 2 | [image] New technical papers recently added to Semiconductor Engineering’s library
#semiconductor #interconnects #3DIC #advancedpackaging #PPA #transistors
@GeorgiaTech @StanfordEng @UCLA @Northeastern | Electronics Design Engineering | — | 506 | 0.1x | 15 | Sep 1 |
| 3 | [image] Latest: Major memory deal; AI Infra Summit news; US chip capacity plans; 2nm & below advances; Huawei’s chip offensive; Chinese equipment makers gain share; India’s chip build-out; McKinsey’s tech trends; major funding rounds..
#semiconductor #semiEDA | Electronics Design Engineering | — | 475 | 0.1x | 9 | Sep 18 |
| 4 | [image] Chip Industry Technical Paper Roundup
#semiconductor #gpus #hardwaresecurity #AgenticAI #semiEDA #rowhammer #PDN | Electronics Design Engineering | — | 439 | 0.1x | 8 | Sep 29 |
| 5 | [image] As AI chips move to stacked, chiplet-based architectures, EDA vendors are reworking mature tools for cross-domain analysis, faster exploration, and agentic AI assistance.
#semiEDA #3DIC #semiconductor #chipdesign | Electronics Design Engineering | — | 356 | 0.1x | 6 | Sep 24 |
| 6 | [image] Specialization and orchestration are becoming more important as the role of AI agents in chip design widens, but coordination, control, and trust remain challenging.
#semiEDA #AgenticAI #AIagents #SLMs #chipdesign #semiconductor | Electronics Design Engineering | — | 310 | 0.1x | 7 | Sep 28 |
| 7 | [image] Warpage is becoming a bigger constraint as package, interposer, and panel sizes grow.
#semiconductor #warpage #advancedpackaging
#CTE #NTE #underfill | Semiconductor & VLSI | — | 250 | 0.0x | 9 | Sep 17 |
| 8 | [image] Options and workarounds for improving reliability in chips.
#DFT #semiconductor #BiST @siemenssoftware
#PTAP #FPP | Semiconductor & VLSI | — | 221 | 0.0x | 5 | Sep 21 |
